OBJECTIVE
Seeking an Engineering position where my experience and knowledge can be utilized and further developed.
EDUCATION
B.S. Industrial Technology University of Maryland
EMPLOYMENT HISTORY
Sheet metal fabrication (6 years):
• Manufacturing engineer for sheet metal fabrication. Developed flat blanks. Programmed and maintained Amada 50 ton CNC punch press. Inspector for sheet metal fabrication. This included operating the machine and servicing the machine. Calculating die clearance for different gage sheet metal. I also ran spot welders, and brake press machines.
Printed circuit card fabrication (22 years):
• Manufacturing engineer with emphasis on printed circuit board assembly for military applications. This includes through hole and surface mount technologies built to military specifications. IPC-610 Acceptability of Electronic Assemblies certified specialist. Wrote detailed build instructions for floor personnel based on drawings of parts. This involved taking Autocad drawings from design and editing them into a Word document along with text to provide an instruction the assembly floor can follow to assemble the boards. Modify and program CS400 semi-automatic cut and clinch machines. These machines are used for through hole printed circuit boards. Our plant had an Electrovert wave solder machine with a chip wave for SMT parts. Experienced in troubleshooting common floor build problems related to solder defects and conformal coating defects. Interfaced with engineering to resolve print and bill of material problems.
• Wrote detailed repair instructions for printed circuit boards that were returned from the Navy to update and repair these assemblies per IPC specifications. Evaluated if PCB could be repaired or should be scrapped in conjunction with Quality Assurance and on site DOD inspectors.
• On ISO implementation team full time for one year (1994). Our team worked to write and document all functions of our company to pass and maintain ISO certification. Reviewed manufacturing engineering documents on a yearly basis to ascertain if they were still correct and update any changes in procedures.
• ESD (Electro static discharge) trainer ESD point of contact. Supervised monthly audit of ESD mats and jacks. ESD discharge is a major concern for destroying sensitive electronics components and must be controlled in assembly areas to maintain high quality workmanship. Supervised employees checking solder irons for conformance to ESD specifications and maintained logs for outside audit review by ISO auditors and DOD auditors.
• Was on the lead free team to examine quality issues with using lead free solder. This is a major concern of military contractors for quality of electronics that may have to last 20 to 30 years in the field. This team worked in conjunction with other teams at all Northrop Grumman campuses to discuss the impact of lead free solder on reliability of high performance electronics.
• Was responsible for entering standards and routings for all work areas into Baan ERP. Reviewed historical build times for new quotations to adjust times in Baan to be more in alignment to actual build times. In relation to this activity modified floor production orders to track with modified directions to build and times.
• Packaging engineer (two years). Specified types of packaging for military specification packaging. Managed $200,000 budget for material acquisition and ordered packaging supplies. Interfaced with suppliers of packaging supplies including lumber, boxes, and foam. This included new designs for cabinets to be packed for the U.S. Navy as well as foreign navies. These cabinets could have a cost of $500,000 and had to be shipped all over t...
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